AMD, CPU "Milan-X" equipped with 3...
24
09
AMD, CPU "Milan-X" equipped with 3 times L3 cache.Approximately 50 % improvement
AMD will hold an event "AMD Accelerated Data Center Premiere" that introduces new products and roadmaps for data centers/HPCs, and among them, the next CPU "Milan-X" for the next data center (developed).Code name) and "GENOA" (same) were announced.
Milan-X adopts a 3D chiplet technology implemented by stacking cache in the vertical direction based on the existing 3rd generation EPYC processor.As a result, an L3 cache memory called "3D V-CACHE" was integrated into one package.The total cache capacity reaches 804MB.
As the L3 cache capacity is tripled as usual, the memory band width is expanded and the latency is reduced.Assuming that only a BIOS upgrade from an existing system can improve the performance by 50%.
The EPYC CPU equipped with 3D V-CACHE is scheduled to be shipped in the first quarter of 2022, and a server solution equipped with Cisco, Dell Technologies, Lenovo, HPE, and Supermicro will appear.
In addition, in 2022, a 5nm process ZEN 4 -based high -performance CPU "GENOA" was also notified.The adoption of 5nm will double the density, double the power efficiency, and the performance 1.Improve 25 times.In addition to containing up to 96 cores, new DDR5 memory and PCI Express 5.The response to 0 was also intended.
Genoaの特徴Furthermore, "BERGAMO" will be launched in the first half of 2023.This is a new "ZEN 4C" core that can achieve more core number in a cache hierarchy specialized in density, achieving up to 128 cores.It is optimized for cloud native applications and dramatically improves the number of cores per socket.
Zen 4cはキャッシュ階層を密度重視とすることでコア数を向上させるBergamo
